In the _____ method, a large amount of solder is melted in a tank that is closed.

Question

Question

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RRB JE CBT 2 (Mechanical Engineering) ReExam Official Paper (Held On: 04 Jun, 2025)

Answer 1

Explanation:

Dip Soldering:

Dip soldering is a soldering method in which a large amount of solder is melted in a tank or pot that is closed. Components or electronic assemblies are then dipped into the molten solder to create a solder joint. This method is commonly used in manufacturing processes for soldering through-hole components onto printed circuit boards (PCBs) and for other similar applications.
In dip soldering, the soldering process is achieved by immersing the component leads or the PCB into the molten solder. Flux is often applied beforehand to clean the surfaces and improve the wetting of the solder. As the component is removed from the molten solder, the solder adheres to the areas with proper flux and forms a strong joint after cooling and solidification. This method is especially suitable for large-scale production due to its efficiency and cost-effectiveness.

Steps in Dip Soldering:

Preparation: The components or PCB are cleaned to remove any contaminants, and flux is applied to ensure proper solder adhesion.
Heating: Solder is melted in a solder pot or tank, which is maintained at a consistent temperature to ensure uniform soldering results.
Immersion: The component or PCB is dipped into the molten solder for a specific amount of time. The solder adheres to the exposed metal areas that have been treated with flux.
Cooling: Once removed from the solder bath, the soldered assembly is allowed to cool, forming strong mechanical and electrical connections.